Bulk filler for sintered conductor paste
♦ Good dispersion, no aggregation
♦ Good match with glass powder
The main filler of low temperature curing slurry
♦ Loose packing density is low
♦ Large oil absorption
♦ Good conductivity
The main filler of low temperature curing slurry
♦ Good dispersion
♦ disaggregation
♦ Polyester and polyurethane match well
For conductive phase in electronic paste, antibacterial coating, MLCC ceramic capacitor
♦ Good dispersion
♦ High vibration density
♦ Concentration of particle size distribution
Fully meet MLCC copper slurry
♦ high-crystallized
♦ High oxidation resistance
♦ Spherical and flaky copper powder
Sintered electronic paste bonding phase
♦ The particle size distribution is narrow and easy to disperse
♦ Chemical stability, high weather resistance
♦ It has good wettability and good matching of substrate